URBANA, Ill. (AP) — The University of Illinois’ engineering college and a company led by a graduate of the school are partnering on a technology center.
The $100 million Center for Networked Intelligent Components and Environments will develop technology for use in transportation, manufacturing, medicine and homes. The center will be housed in the Grainger College of Engineering on the university’s campus in Urbana-Champaign.
The company, Foxconn Interconnect Technology, has committed to $50 million over ten years toward research and programs through the center. The university, the Discovery Partners Institute and the Illinois Innovation Network plan to invest $50 million including facilities and faculty hires for the center.
Researchers from the company and the university will work together on the projects.